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PCB process lines

Boards
on process.

CNC and laser drilling, LDI, DES, plating, AOI and solder-mask lines for printed-circuit fabrication. Quoted against your panel size and IPC class.

12catalogue machines
1 dayquote response

Catalogue

PCB Equipment

CNC and laser drilling, LDI, DES, plating, AOI and solder-mask lines for printed-circuit fabrication. Quoted against your panel size and IPC class.

Panel Cutting Machine for PCBPCB

Panel Cutting Machine for PCB

Shears copper-clad laminate to panel size before drilling, with square edges for downstream registration.

  • Panel up to 24 × 24 in
  • CCL / FR-4 / CEM
  • Square-cut, low burr
CNC PCB Drilling MachinePCB

CNC PCB Drilling Machine

Multi-spindle CNC drilling for through-holes and tooling holes on rigid and multilayer panels.

  • Hole Ø 0.1–6.35 mm
  • Multi-spindle gantry
  • Excellon / Sieb & Meyer
Laser Drilling Machine HDIPCB

Laser Drilling Machine (HDI)

UV / CO2 laser microvia drilling for HDI and sequential-build-up boards.

  • Via Ø 50–150 µm
  • UV / CO2 dual source
  • HDI / SBU panels
Electroless Copper Plating LinePCB

Electroless Copper Plating Line

PTH line depositing seed copper in drilled holes before electrolytic plating.

  • Horizontal or vertical
  • Desmear + electroless Cu
  • Panel 18 × 24 in class
Dry Film LaminatorPCB

Dry Film Laminator

Hot-roll laminator applying photoresist dry film to cleaned copper surfaces.

  • Film 15–50 µm
  • Hot-roll, dual side
  • Width to 24 in
LDI Laser Direct Imaging MachinePCB

LDI Laser Direct Imaging Machine

Maskless laser imaging of inner and outer layers, replacing film artwork.

  • Line / space to 25 µm
  • Registration ±10 µm
  • Inner / outer / SM
DES Line Developer-Etcher-StripperPCB

DES Line (Developer-Etcher-Stripper)

Horizontal wet line that develops, etches and strips dry film in one pass.

  • Conveyor wet process
  • Alkaline / acid etch
  • Inner and outer layers
AOI Automated Optical InspectionPCB

AOI Automated Optical Inspection

Camera AOI for inner layers, outer layers and solder mask before electrical test.

  • Inner / outer / SM
  • CAM netlist compare
  • Defect image archive
Vacuum Lamination PressPCB

Vacuum Lamination Press

Multi-opening vacuum press bonding multilayer stacks with controlled heat and pressure.

  • Multi-opening platens
  • Vacuum + heat/pressure
  • FR-4 / high-Tg / PTFE
Solder Mask Coating MachinePCB

Solder Mask Coating Machine

Screen or spray coating of liquid photoimageable solder mask onto outer layers.

  • LPI screen / spray
  • Dual-side coating
  • IR / UV pre-cure
HAL Hot Air Leveling MachinePCB

HAL Hot Air Leveling Machine

HASL / HAL finishing that coats exposed copper with solder and levels with hot air.

  • Lead-free or SnPb
  • Vertical or horizontal
  • IPC-6012 surface finish
PCB Brushing and Cleaning LinePCB

PCB Brushing & Cleaning Line

Mechanical brushing and chemical cleaning before dry-film lamination or solder mask.

  • Pumice / brush / chemical
  • Horizontal conveyor
  • Pre-lam / pre-SM

Capabilities

PCB process matching

01

Drilling & imaging

CNC, laser and LDI sized to your panel and stack-up.

02

Wet process

DES, PTH and finishing lines quoted to chemistry and capacity.

03

FAT & manuals

Factory acceptance and English operating files with the shipment.

04

Export packing

Crate packing for precision tools.

Facility

PCB process halls

Wet lines and drilling bays behind every quotation.

01Production
Quoted to specification

Send drawings or process windows. The team replies within one business day.

02Process bay

Quality

Shipped with the process file

Utility drawings and FAT records travel with the machine.

  • Factory records on request
  • Export packing
  • English documentation

HANDOVER

01Specification checkAgainst drawing or process window
02Packing listLot and serial numbers

Request a quotation

Send your PCB process specification.

Panel size, stack-up and destination. Reply within one business day.

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